| 摘要 |
The present disclosure relates to a test head for electrical testing of a test specimen, in particular a wafer, having at least two guide plates, which are spaced apart by means of at least one spacer and have guide holes distributed over the surfaces thereof, in which test contact pins for physical contact with the test specimen are guided in a sliding manner. Provision is made for the spacer to be formed by a multiplicity of point supports arranged in a manner distributed over the surfaces of the guide plates and secured on the guide plates. |
