发明名称 METHOD FOR MANUFACTURING SENSOR ELEMENT AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce a manufacturing cost of a semiconductor device comprising a chemical sensor or to perform detection with high accuracy by a plurality of measuring principles.SOLUTION: A semiconductor device comprises a first sensor element and a second sensor element, where the first sensor element comprises a first conductive layer and a first sensitive film formed on the first conductive layer, and the second sensor element comprises a second conductive layer different from the first conductive layer and a second sensitive film formed on the second conductive layer. A method for manufacturing a sensor element comprises: a process (a) for forming the conductive layers of the sensor element in a semiconductor substrate or on the semiconductor substrate; and a process (b) for forming the sensitive films by discharging liquid including a component constituting the sensitive films by an ink jet device on the conductive layers.
申请公布号 JP2014032209(A) 申请公布日期 2014.02.20
申请号 JP20130217559 申请日期 2013.10.18
申请人 SEIKO EPSON CORP 发明人 KATO JURI
分类号 G01N27/414;H01L21/336;H01L29/78;H01L29/786 主分类号 G01N27/414
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