发明名称 |
SOLDER ON TRACE TECHNOLOGY FOR INTERCONNECT ATTACHMENT |
摘要 |
A solder on trace device includes a conductive trace on a semiconductor substrate surface. The conductive trace has a sidewall and a bonding surface. The solder on trace device also includes a passivation layer on at least one end of the conductive trace. The solder on trace device further includes a pre-solder material on the sidewall and the bonding surface of the conductive trace. |
申请公布号 |
WO2014028567(A1) |
申请公布日期 |
2014.02.20 |
申请号 |
WO2013US54849 |
申请日期 |
2013.08.14 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
KUMAR, RAJNEESH;BCHIR, OMAR, JAMES |
分类号 |
H01L23/00;H01L21/48;H01L23/14;H01L23/498;H05K3/34 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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