The present invention relates to a component feeding apparatus and method. According to one embodiment of the present invention, the component feeding apparatus includes a transfer part transferring components; a mounting surface change part changing the mounting surface of the components; and a gas injection part spaying a gas to a region separated from the transfer surface of the transfer part.
申请公布号
KR20140021150(A)
申请公布日期
2014.02.20
申请号
KR20120086912
申请日期
2012.08.08
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
CHAE, PUM SAN;LIM, JAE SUN;LEE, BYUNG HUN;RYU, JIN YUNG;CHUN, SEUNG HO;LIM, GWANG IL