发明名称
摘要 <p>According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.</p>
申请公布号 JP5422379(B2) 申请公布日期 2014.02.19
申请号 JP20090509578 申请日期 2007.04.10
申请人 发明人
分类号 H01L23/427;F28D15/02 主分类号 H01L23/427
代理机构 代理人
主权项
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