| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plugging resin composition and a printed wiring board capable of exactly confirming the existence of a filling defect and a defect such as a short-circuited region or the like after circuit formation without erroneously recognizing the filling point of the resin composition for plugging as the defect, when AOI is used as an appearance inspection method. <P>SOLUTION: A plugging resin composition of a printed wiring board contains an epoxy resin, an epoxy resin curing catalyst, and a filler. An L value of an L*a*b* color system for a curing object generated using the plugging resin composition is 75-100. <P>COPYRIGHT: (C)2011,JPO&INPIT |
