| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin sealing apparatus which prevents entrainment of air bubbles to improve molding quality when resin-sealing a semiconductor-mounting substrate made by mounting a plurality of semiconductors onto a large-size substrate and can facilitate positioning or handling of the substrate which is sucked and retained to a mold. <P>SOLUTION: In an upper mold 1, an upper mold insert 5 is elastically bent beforehand so as to become convex downwards toward the center position of a cavity recessed part 17 and is assembled to an upper chase 4 fixed onto an upper base 3 and, when a mold is clamped, the upper mold insert 5 is pushed back flatly by a resin pressure, is positioned so as to be surrounded by sidewalls of the upper chase 4 and continues to operate a clamping pressure by means of bending of the upper insert 5 even after an encapsulation resin 25 is cured and contracted. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
