| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible printed wiring board on which a light-emitting element is mounted via solder, for releasing stress applied to the solder due to a temperature change at the time of increase or decrease in temperature caused when the light-emitting element is mounted or the light-emitting element is turned on or off thereby preventing cracks or the like from occurring in the solder and realizing high electrical and mechanical connection reliability. SOLUTION: A flexible printed wiring board 10 comprises a conductive layer 12 including a circuit part 12a and laminated on a front surface side of a substrate layer 11, and a heat radiation layer 13 of a metallic material having high thermal conductivity and laminated on a back surface side of the substrate layer 11, a light-emitting element part 30 mounted on a part of the circuit part 12a via solder, and a stress release layer 14 of a metallic material formed on an under surface side of the heat radiation layer 13 for releasing stress applied to a solder part 20 due to a temperature change at the time of increase or decrease in temperature. COPYRIGHT: (C)2012,JPO&INPIT |
