发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a single-particle film etching mask on a curved surface closely two-dimensionally packed with and highly precisely disposed with respective particles constituting a single-particle film; to provide a manufacturing method of the same; to provide a manufacturing method of a microstructure on the curved surface using the single-particle film etching mask; and to provide a highly precise microstructure on the curved surface acquired by the manufacturing method. <P>SOLUTION: The single-particle film is formed on a substrate whose one part or whole part is formed of a surface having a surface-directional pitch or size of 0.1 &mu;m-10000 &mu;m at a non-planar surface such as a curved face, an inclined surface and a step, the single-particle film being closely two-dimensionally packed with the particles. In the single-particle film, a displacement D (%) of a particle array defined by the following expression (1) is 10% or less. D(%)=¾B-A¾&times;100/A...(1) (In the expression (1), A represents an average particle diameter of the particle, and B represents an average pitch between the particles in the single-particle film). <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5423758(B2) 申请公布日期 2014.02.19
申请号 JP20110215110 申请日期 2011.09.29
申请人 发明人
分类号 G02B1/11;B01J19/00;B29C33/38;B29C45/26;B29C59/02;B82Y40/00;H01L21/027 主分类号 G02B1/11
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