发明名称 Cathodic sputtering device
摘要 <p>Metallic welded joints in the device are maintained fluid tight by metallic grids which are brought to a potential close to that of the anode. The grids are placed between the part of the enclosure where the discharge is produced and the part closest to the non-metallic elements comprising the enclosure. The openings in the grids are pref. ca. 1/10mm.</p>
申请公布号 FR2058821(A5) 申请公布日期 1971.05.28
申请号 FR19690033079 申请日期 1969.09.29
申请人 RADIOTECHNIQUE LA COMPEL 发明人
分类号 C23C14/56;H01J37/34;(IPC1-7):23C15/00 主分类号 C23C14/56
代理机构 代理人
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