| 摘要 |
A circuit board assembly includes two external circuit boards, at least one electrical connector, at least one electronic component, and at least one hollow substrate. Each external circuit board includes an external electromagnetic shielding layer, a circuit layer and a dielectric layer. In each external circuit board, the dielectric layer is located between the external electromagnetic shielding layer and the circuit layer. The electrical connector is connected between the circuit layers located between the external electromagnetic shielding layers. The electronic component is disposed between the external circuit boards and connected with one of the circuit layers. The hollow substrate with plural openings is disposed between the external circuit boards. The electronic component and the electrical connector are located in the openings. Both a thickness of the electronic component and a height of the electrical connector are smaller than or equal to a thickness of the hollow substrate. |
