发明名称 |
Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation |
摘要 |
Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, including a die and an encapsulant material formed over the die, and at least one topological feature formed on an external surface of the encapsulant material, and configured to resist out-of-plane deformation of the package. Other embodiments may be described and claimed. |
申请公布号 |
US8653675(B2) |
申请公布日期 |
2014.02.18 |
申请号 |
US20090628042 |
申请日期 |
2009.11.30 |
申请人 |
ZHANG JAMES JIAN;BRAND JASON;BROOKSBY JACOB;ESHETE DEJEN;YIM MYUNG JIN;ADIMULA RAVIKUMAR;GRAVES DAN;MICRON TECHNOLOGY, INC. |
发明人 |
ZHANG JAMES JIAN;BRAND JASON;BROOKSBY JACOB;ESHETE DEJEN;YIM MYUNG JIN;ADIMULA RAVIKUMAR;GRAVES DAN |
分类号 |
H01L23/28;H01L23/29 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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