| 摘要 |
Systems and methods for solid-state light source heat management are provided. A solid-state light source, e.g. having one or more LEDs, can be mounted within an enclosure. In some embodiments, a heat sink associated with semiconductor material and/or power electronics can be placed on a separate side of the enclosure that is thermally insulated or separated from the state-light source. The enclosure can include a first side or portion that allows light from the solid-state-light source (e.g., LEDs) to pass through to a target area. A fluid transfer conduit may be connected to the second side or portion of the enclosure for passing a fluid (e.g., air, water, coolant, etc.) across the heat sink to transport heat generated by the power electronics and/or semiconductor material away. The heated fluid can then be routed to, as examples, an HVAC system, a vent, water heating systems, heat exchanger systems, and/or storage systems (e.g., batteries). |
