| 摘要 |
Disclosed are a stacked semiconductor package and a manufacturing method thereof. The disclosed stacked semiconductor package includes a lower semiconductor package comprising a first substrate with a first ball land on the upper surface, a first solder ball which is mounted on the first ball land, and a first mold part which seals the upper surface of the first substrate and has a groove exposing the first solder ball; and an upper semiconductor package which has a second solder ball at the bottom, wherein the second solder ball is combined with the groove, and is laminated on the lower semiconductor package to be bonded to the first solder ball in the bottom of the groove. |
