| 摘要 |
The application relates to a method for fabricating a microelectromechanical or microoptoelectromechanical component comprising an active structure hermetically tightly sealed. The application provides a simple method for forming contact holes for contacting specific parts of the component without introducing material stress to the component. The method comprises producing a first layer composite, producing a second layer composite, applying an at least partly conductive structure layer to the first layer composite, applying the second layer composite to the structure layer such that at least one part of the structure layer is hermetically tightly sealed by the first and second layer composites, wherein the at least one part comprises the active area of the component, and forming contact holes for making contact with conductive regions of the structure layer within at least one of the first or the second layer composite after applying the second layer composite to the structure layer. |
