发明名称 SPIN COATING DEVICE WITH MULTI-POINT CONTACT ALIGNMENT DEVICE
摘要 <p>The present invention relates to a rotary coating device having a multipoint contact alignment device and more specifically, to a multipoint contact alignment device capable of obtaining an accurate center by enabling the size of a wafer to be diversified and uniform coating in a rotation coating process by installing the multipoint contact alignment device in a wafer rotation coating device used in a process for coating a photo resist substance. The present invention relates to a rotation coating device for a wafer (110) comprising: a rotation unit (10) included in a main body (100) to rotate the wafer (110) mounted thereon; an alignment unit (20) preventing the wafer (110) from being out of the center while rotating and included in the upper part of the main body (100) to prevent a distortion phenomenon; and a bowl unit (30) enclosing the rotation unit (10) to discharge the photo resist generated in the alignment unit (20) to the outside. The present invention maintains the accurate center in the rotation coating process and performs the coating process regardless of the size of the wafer. The present invention also prevents vibration and coating distortion generated when the wafer is coated with accurate alignment.</p>
申请公布号 KR101362261(B1) 申请公布日期 2014.02.18
申请号 KR20120100339 申请日期 2012.09.11
申请人 JUNG, DONG HWAN 发明人 JUNG, DONG HWAN
分类号 H01L21/027 主分类号 H01L21/027
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