发明名称 Deposition substrate and method for manufacturing light-emitting device
摘要 The deposition substrate of the present invention includes a light-transmitting substrate having a first region and a second region. In the first region, a first heat-insulating layer transmitting light is provided over the light-transmitting substrate, a light absorption layer is provided over the first heat-insulating layer, and a first organic compound-containing layer is provided over the light absorption layer. In the second region, a reflective layer is provided over the light-transmitting substrate, a second heat-insulating layer is provided over the reflective layer, and a second organic compound-containing layer is provided over the second heat-insulating layer. The edge of the second heat-insulating layer is placed inside the edge of the reflective layer, and there is a space between the first heat-insulating layer and the second heat-insulating layer.
申请公布号 US8653543(B2) 申请公布日期 2014.02.18
申请号 US201113092272 申请日期 2011.04.22
申请人 YOKOYAMA KOHEI;IKEDA HISAO;SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 YOKOYAMA KOHEI;IKEDA HISAO
分类号 H01L29/18;H01L51/50;H05B33/10 主分类号 H01L29/18
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