发明名称 |
Packaged semiconductor chips with array |
摘要 |
A chip-sized, wafer level packaged device including a portion of a semiconductor wafer including a device, at least one packaging layer containing silicon and formed over the device, a first ball grid array formed over a surface of the at least one packaging layer and being electrically connected to the device and a second ball grid array formed over a surface of the portion of the semiconductor wafer and being electrically connected to the device. |
申请公布号 |
US8653644(B2) |
申请公布日期 |
2014.02.18 |
申请号 |
US201213407085 |
申请日期 |
2012.02.28 |
申请人 |
GRINMAN ANDREY;OVRUTSKY DAVID;ROSENSTEIN CHARLES;OGANESIAN VAGE;TESSERA, INC. |
发明人 |
GRINMAN ANDREY;OVRUTSKY DAVID;ROSENSTEIN CHARLES;OGANESIAN VAGE |
分类号 |
H01L23/50 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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