| 摘要 |
The purpose of the present invention is to improve heat emitting properties of a semiconductor device. The semiconductor device (10) includes an insulation layer (21); a first semiconductor device (22) embedded in the insulation layer (21); and a second semiconductor device (23). A semiconductor device (10) also includes a frame (24) having higher heat conductivity than the insulation layer (21) and enclosing the first semiconductor device (22) and the second semiconductor device (23) by including the insulation layer (21). A wiring layer (30) including a conductive unit (31) electrically connected to the first semiconductor device (22) and the second semiconductor device (23) is installed on the upper part of the insulation layer (21). The frame (24) is installed around the first semiconductor device (22) and the second semiconductor device (23) in the insulation layer (21) so that the heat emitting properties of the semiconductor device (10) can be improved. |
