| 摘要 |
During the joining of PTFE parts (10), a binder (20) is applied to the joint surfaces of the PTFE parts, e.g. by welding, before the parts are joined. By establishing a bond between PTFE and binder in a separate, initial process, the parameters of this initial process may be determined regardless of other conditions, such as maintaining the dimensions, and the quality of this bond may be controlled and approved before the subsequent joining of the PTFE parts. During the subsequent joining, the temperature may be kept at a level, which is sufficiently low so as not to deform the PTFE material permanently, or the joining may be carried out by a process, which does not require heating, for example gluing. |
