发明名称 Integrated circuit device
摘要 An integrated circuit device includes: a first chip including a first substrate and a main circuit formed on said first chip; a second chip stacked on the first substrate and including a second substrate that is independent from the first substrate, and a protective circuit for protecting the main circuit; and a conductive channel unit extending from the protective circuit and electrically connected to the main circuit.
申请公布号 US8653641(B2) 申请公布日期 2014.02.18
申请号 US201213613480 申请日期 2012.09.13
申请人 CHEN KUAN-NENG;LAI MING-FANG;CHEN HUNG-MING;NATIONAL CHIAO TUNG UNIVERSITY 发明人 CHEN KUAN-NENG;LAI MING-FANG;CHEN HUNG-MING
分类号 H01L21/50 主分类号 H01L21/50
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