发明名称 |
Microelectronic assemblies |
摘要 |
Embodiments enable for the creation of microelectronic modules that may be configured in any order within a microelectronic assembly. The microelectronic modules provide for point-to-point interconnects between the modules using a standardized connector that is the same for each module. This, thereby, eliminates the need for a backplane. The modules may be configured in any order within a microelectronic assembly. No prior knowledge regarding the functions of an individual microelectronic module is required if the microelectronic modules conform to the standardized I/O of the standardized connector. |
申请公布号 |
US8653377(B2) |
申请公布日期 |
2014.02.18 |
申请号 |
US201113080013 |
申请日期 |
2011.04.05 |
申请人 |
CHAMPION SHAUN L.;IVES PHILIP H.;ANDREAS HARRY A.;LEE NORMAN C.;DOOLEY KARRIE D.;RAYTHEON COMPANY |
发明人 |
CHAMPION SHAUN L.;IVES PHILIP H.;ANDREAS HARRY A.;LEE NORMAN C.;DOOLEY KARRIE D. |
分类号 |
H05K1/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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