| 摘要 |
<p>A semiconductor package is provided. The semiconductor package includes a mounting region and a molding region surrounding the mounting region, a wiring substrate having a through hole penetrating the center part of the mounting region, a semiconductor chip mounted in the mounting region of the wiring substrate by a flip chip method, and a molding part synchronously covering the molding region of the wiring substrate and the semiconductor chip, and filling the though hole and a space between the semiconductor chip and the wiring substrate. The molding part filling the through hol, and a second surface lie in the same plane. The second surface faces the first surface of the wiring substrate on which the semiconductor chip is mounted.</p> |
