发明名称 |
DUAL MESH TYPE ELECTRO-CHEMICAL PLATING APPARATUS AND ELECTRO-CHEMICAL PLATING METHOD OF PRINTED CIRCUIT BOARD USING THE SAME |
摘要 |
Disclosed are a dual mesh type electro-chemical plating apparatus which is capable of reducing consumption of a plating liquid and controlling a product quality by improving a plating variation by supplementing a plating weak part, and an electro-chemical plating method of a printed circuit board using the same. According to the present invention, a dual mesh type electro-chemical plating apparatus comprises: a plating bath for accommodating a plating solution; a positive pole rod mounted on both edges of the plating bath; a negative rod mounted on the center of the plating bath and connected to a printed circuit board; a metal mesh mounted to be fixated to an end of the negative rod; a supplementary negative rod which is mounted on the center of the plating bath, and which is arranged in a position corresponding to the center of the printed circuit board; and a supplementary metal mesh mounted on an end of the supplementary negative rod. |
申请公布号 |
KR101362083(B1) |
申请公布日期 |
2014.02.14 |
申请号 |
KR20120150288 |
申请日期 |
2012.12.21 |
申请人 |
SIMM TECH CO., LTD. |
发明人 |
PARK, JUNG KUN;HWANG, TAE WON;NAM, DO HYEON |
分类号 |
C25D17/02;C25D7/00;C25D17/10 |
主分类号 |
C25D17/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|