发明名称 |
CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTION STRUCTURE, AND CIRCUIT MEMBER CONNECTION STRUCTURE MANUFACTURING METHOD |
摘要 |
The present invention is a circuit connection material for electrically connecting opposing circuit electrodes, comprising an adhesive composition and conductive particles. The conductive particles are aggregated particles with an average particle diameter of 5-20�m, having a metal or nickel core with a Vickers hardness of 300-1000 and an outermost layer of a precious metal coating the core. Unevennesses are formed on the surface of the conductive particles. |
申请公布号 |
KR20140019380(A) |
申请公布日期 |
2014.02.14 |
申请号 |
KR20137027238 |
申请日期 |
2012.04.10 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
NAKAZAWA TAKASHI;FUJINAWA TOHRU;TAKEMURA KENZOU;IIJIMA YUUSUKE |
分类号 |
H01R11/01;H01B1/22;H01R4/04;H05K1/14 |
主分类号 |
H01R11/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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