发明名称 CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTION STRUCTURE, AND CIRCUIT MEMBER CONNECTION STRUCTURE MANUFACTURING METHOD
摘要 The present invention is a circuit connection material for electrically connecting opposing circuit electrodes, comprising an adhesive composition and conductive particles. The conductive particles are aggregated particles with an average particle diameter of 5-20�m, having a metal or nickel core with a Vickers hardness of 300-1000 and an outermost layer of a precious metal coating the core. Unevennesses are formed on the surface of the conductive particles.
申请公布号 KR20140019380(A) 申请公布日期 2014.02.14
申请号 KR20137027238 申请日期 2012.04.10
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 NAKAZAWA TAKASHI;FUJINAWA TOHRU;TAKEMURA KENZOU;IIJIMA YUUSUKE
分类号 H01R11/01;H01B1/22;H01R4/04;H05K1/14 主分类号 H01R11/01
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