| 摘要 |
The present invention provides a circuit connection material with improved repair performance. The circuit connection material according to the present invention contains an epoxy resin, a cationic polymerization initiator, and acrylic rubber including methyl (meth) acrylate copolymers. Therefore, the present invention can obtain improved repair performance by preventing breakage when the circuit connection material is peeled off due to misalignment since high mechanical strength is obtained when being pressurized on the terminal of a first electronic component. |
