THE METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD

摘要

Provided is a method of manufacturing a rigid-flexible printed circuit board, which comprises: a substrate providing step of providing one pair of rigid substrates and a flexible substrate inserted between the one pair of rigid substrates and having one end extending out of the rigid substrates; a film mounting step of mounting a cover film at the extending portion of the flexible substrate; a jig providing step of providing one pair of compressing jigs which is disposed under the rigid substrates and the flexible substrate, has a protrusion corresponding to stepped portions of the rigid substrates and the flexible substrate to compress the rigid substrates and the flexible substrate and compress the flexible substrate and the mounted cover film; and a pressurizing step of pressurizing the one pair of the compressing jigs.