| 摘要 |
<p>Disclosed is an alkali-developable photosensitive resin composition which comprises (A) a resin produced using a recovered polyester as a raw material and (B) a photopolymerization initiator. Preferably, the resin (A) is a polyol, a carboxyl-group-containing resin, or a photosensitive resin having an ethylenically unsaturated group, particularly a polyol produced by depolymerizing a recovered polyester (a) with two or more molecules of a polyol (b) per molecule of the polyester (a), a carboxyl-group-containing resin produced by reacting the recovered polyester (a) with a polybasic acid or an anhydride thereof (c) prior to, simultaneously with or subsequent to the depolymerization, or the like. Preferably, the photosensitive resin composition additionally comprises a carboxyl-group-containing photosensitive resin (C) that is different from the resin (A). Preferably, the photosensitive resin composition additionally comprises a heat-curable component (D), or additionally comprises a coloring agent (E). The photosensitive resin composition or a dry film thereof is advantageously applicable to the formation of a cured coating film such as a solder resist for a printed wiring board or a flexible printed wiring board, or the like.</p> |
