| 摘要 |
PROBLEM TO BE SOLVED: To provide a postcure tape excellent in adhesion cured at a relatively low temperature in a short time; and a method for joining a joint member using the postcure tape.SOLUTION: The postcure tape comprises an adhesive layer containing: a film-forming resin; an epoxy resin; an amine-based epoxy thermal latent curing agent; and an imidazole compound represented by the specified general formula (1). In the general formula (1), Rrepresents a C1-C11 alkyl group; and Rand Rrepresent hydrogen, an alkyl group or a benzyl group. |
