METHOD FOR FABRICATING LEAD FRAME

摘要

The present invention is to prevent the generation of a foreign material in the dimple of a lead frame. In a method for fabricating a lead frame, the dimple in the lead frame on a substrate where semiconductor packages are arranged is gap-filled with a filling material. A first sawing process is performed along a sawing line between the gap-filled lead frames filled with the filling material in the sawing process of the semiconductor package in order to partly remove the filling material gap-filled between the lead frames. The residual filling material gap-filled in the dimple of the lead frame are completely removed by a physical or chemical method. A second sawing process is performed along the sawing line between the frames to separate the semiconductor package. Therefore, the generation of the foreign material in the dimple of the lead frame can be prevented.