发明名称 ELECTRONIC COMPONENT AND ACOUSTIC WAVE DEVICE
摘要 An electronic component has a mounting board, a bump located on a mounting surface of the mounting board, a SAW device located on the bump and connected to the bump. The SAW device has an element substrate, an excitation electrode located on the first primary surface of the element substrate, a pad located on the first primary surface and connected to the excitation electrode, and a cover located above the excitation electrode and formed with a pad exposure portion on the pad. Further, the SAW device makes the top surface of the cover face the mounting surface, makes the bump be located in the pad exposure portion, and makes the pad abut against the bump.
申请公布号 US2014042870(A1) 申请公布日期 2014.02.13
申请号 US201214112208 申请日期 2012.04.09
申请人 OHASHI YASUTAKA;NAMBU MASAKI;MORIMOTO YUSUKE;MAKIBUCHI DAISUKE;IKUTA TAKANORI;KYOCERA CORPORATION 发明人 OHASHI YASUTAKA;NAMBU MASAKI;MORIMOTO YUSUKE;MAKIBUCHI DAISUKE;IKUTA TAKANORI
分类号 H01L41/047 主分类号 H01L41/047
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