LEAD FRAME AND MANUFACTURING METHOD OF THE SAME, LEAD FRAME WITH RESIN AND MANUFACTURING METHOD OF THE SAME, AND LED PACKAGE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a lead frame for LED element loading, capable of preventing resin burrs from being generated on the lead frame.SOLUTION: A lead frame 10 for LED element loading includes a die pad (first part) 25, and a lead part (second part) 26 provided separately from the die pad 25. Of the die pad 25 and the lead part 26, on a part corresponding to an intersection of a lower die 35A, an upper die 35B, a reflection resin 23 and the lead frame 10, a linear projection part 63 pressurized by the lower die 35A and the upper die 35B and projected from the other part of the lead frame 10 is provided. By the linear projection part 63, the reflection resin 23 is prevented from flowing into the inner side of the die pad 25 and the lead part 26 when forming the reflection resin 23.