| 摘要 |
The present invention discloses a fingerprint package and a method for manufacturing same, the fingerprint package which enables transmission of a driving signal required for scanning a fingerprint image, improve obtainment sensitivity of a fingerprint sensor by means of smooth swiping, and which has a simple structure so that productivity can be improved during manufacturing. The fingerprint package according to the present invention comprises: a base substrate comprising an interior area, on which a conductive pattern including a bond finger portion is formed and which includes a fingerprint sensor die paddle portion, and an exterior area which is positioned on the outer shell of the interior area and includes a driving electrode die paddle; the fingerprint sensor, which is attached to the fingerprint sensor die paddle on the base substrate and which is provided on the upper surface thereof with a sensor portion and a plurality of input/output pads; a bonding wire for electrically connecting the fingerprint sensor and the bond finger portion on the base substrate; and a mold body for integrally forming the fingerprint sensor and the driving electrode, which are positioned on the base substrate, and for protecting same from the external environment, wherein the driving electrode is formed to have the same height as that of the mold body so that the surface of the driving electrode is exposed to the exterior of the mold body, and wherein the driving electrode is formed around the fingerprint sensor and is connected to the fingerprint sensor through the conductive pattern on the base substrate. |
