| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductivity particle that can obtain a solder paste or solder sheet in which after joint of first and second joint object members, joint reliability and a heat radiation property of the first and second joint object members are raised, further an interval between the first and second joint object members can be controlled with high accuracy.SOLUTION: A conductivity particle 21 is a conductivity particle that is dispersed in a solder, and is used for a solder paste or a solder sheet. The conductivity particle 21 includes: a substrate particle 22; and a conductive layer 23 arranged on a surface 22a of the substrate particle 22. The substrate particle 22 is a resin particle or an organic inorganic hybrid particle. A specific gravity of the conductivity particle 21 is at least 1.5 and at most 4.0. A particle diameter of the conductivity particle 21 is from 8 μm or more to 200 μm or less. |
