BOARD BONDING METHOD, POSITIONING METHOD, MULTILAYER SUBSTRATE MANUFACTURING APPARATUS, POSITIONING DEVICE AND EXPOSURE DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce throughput of a positioning operation in a positioning device.SOLUTION: A positioning device for positioning a substrate having an alignment mark comprises: a first positioning part for positioning the substrate on a first reference position; a second positioning part for positioning a substrate holding member before holding the substrate at a second reference position; and a position detection part for detecting a position of the alignment mark of the substrate after the substrate holding part holds the substrate.