发明名称 HEAT-DIFFUSING SOUND INSULATION SHEET AND HEAT-DIFFUSING SOUND INSULATION STRUCTURE
摘要 <p>The purpose of the present invention is to provide a heat-diffusing sound insulation sheet provided with excellent sound insulating properties and heat diffusing properties and a heat-diffusing sound insulation structure using the heat-diffusing sound insulation sheet. The heat-diffusing sound insulation sheet is obtained by laminating a heat-diffusing member (16) on a sound-insulating member (15). By disposing same inside an external member such as a casing (2), keyboard (3), etc. of a small electronic device, noise generated from an electronic part (5) or a circuit board (4) on which an electronic part (5) is mounted can be insulated. Moreover, by diffusing the heat generated from the electronic part (5) or the circuit board (4) on which the electronic part (5) is mounted, discomfort due to hot spots generated on the external member can be reduced.</p>
申请公布号 WO2014024786(A1) 申请公布日期 2014.02.13
申请号 WO2013JP70968 申请日期 2013.08.02
申请人 POLYMATECH CO. , LTD. 发明人 NIKKI, SOYOKO;FUKUOKA, TATSUYA
分类号 G10K11/16;B32B5/18;H01L23/36;H05K7/20 主分类号 G10K11/16
代理机构 代理人
主权项
地址