| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device which reduces the peeling of an electronic element from a metal member of a substrate for mounting the electronic element.SOLUTION: An electronic device of this invention includes: a substrate 1 for mounting an electronic element which has an insulation substrate 11 and a metal member 12 provided on the insulation substrate 11; and an electronic element 2 which is joined onto the metal member 12 by a brazing material 3. The brazing material 3 includes protruding parts 31 which are provided so as to extend from a lower surface of the electronic element 2 into the electronic element 2. Since the electronic element 2 catches on the protruding parts 31, the probability that the electronic element 2 is peeled from the metal member 12 is reduced. |
