| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which improves heat radiation performance, and to provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device according to one embodiment comprises: a heat radiation member where a groove is formed on an upper surface; a joining member which is provided on the heat radiation member burying the groove; and a wiring board which includes a light emitting part provided on an upper surface and a joined electrode provided on a lower surface, the wiring board where the joined electrode is joined to the heat radiation member through the joining member. |
