| 发明名称 |
RESIN PASTE COMPOSITION FOR BONDING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE |
| 摘要 |
<p>A resin paste composition for bonding a semiconductor element, said composition containing: a compound that has a (meth)acryloyloxy group; a polymerization initiator; a flexibility-imparting agent; an amine compound; and powdered aluminum.</p> |
| 申请公布号 |
KR20140018901(A) |
申请公布日期 |
2014.02.13 |
| 申请号 |
KR20137024233 |
申请日期 |
2012.03.05 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
INOUE YUKARI;YAMADA KAZUHIKO |
| 分类号 |
C09J4/02;C09J11/04;C09J11/06;H01L21/52 |
主分类号 |
C09J4/02 |
| 代理机构 |
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代理人 |
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