| 摘要 |
The present invention relates to a heat treatment device (40) reducing footprint thereof. The heat treatment device comprises a first heating part (210) and a second heating part (211) heat treating a wafer (W) by mounting the same; a first cooling device (240) and a second cooling device (241) cooling the wafer by mounting the same; a moving device (251) moving the cooling devices between a position for the upper part of the heating parts to be delivered and a cooling position for cooling the wafer. The first and second heating parts are arranged with the cooling devices as the center. The moving device moves the cooling device in a horizontal direction. |
