METHODS OF AND APPARATUS FOR PRODUCING WAFERS

摘要

An aspect of the present invention pertains to a method of fabricating wafers. One embodiment comprises a method of processing a substrate having defects into a wafer. The method comprises grinding the substrate to flatness while supporting the substrate in a grinding apparatus so that there is minimum or substantially zero stress on the substrate. Another aspect of the present invention comprises a substrate holder for holding a substrate as part of grinding processes to produce a flat surface on the substrate.