发明名称 |
Fine Pitch Package-on-Package Structure |
摘要 |
A package-on-package (PoP) device including a substrate having an array of contact pads arranged around a periphery of the substrate, a logic chip mounted to the substrate inward of the array of contact pads, and non-solder bump structures mounted on less than an entirety of the contact pads available. |
申请公布号 |
US2014042622(A1) |
申请公布日期 |
2014.02.13 |
申请号 |
US201213572417 |
申请日期 |
2012.08.10 |
申请人 |
TSAI TSAI-TSUNG;LIN CHUN-CHENG;ANG AI-TEE;TSAI YI-DA;CHENG MING-DA;LIU CHUNG-SHI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
TSAI TSAI-TSUNG;LIN CHUN-CHENG;ANG AI-TEE;TSAI YI-DA;CHENG MING-DA;LIU CHUNG-SHI |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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