发明名称 CONTACT STRUCTURE OF SEMICONDUCTOR DEVICE
摘要 The disclosure relates to a semiconductor device. An exemplary structure for a contact structure for a semiconductor device comprises a substrate comprising a major surface and a cavity below the major surface; a strained material in the cavity, wherein a lattice constant of the strained material is different from a lattice constant of the substrate; a Ge-containing dielectric layer over the strained material; and a metal layer over the Ge-containing dielectric layer.
申请公布号 US2014042500(A1) 申请公布日期 2014.02.13
申请号 US201213571201 申请日期 2012.08.09
申请人 WANN CLEMENT HSINGJEN;YEH LING-YEN;SHIH CHI-YUAN;CHEN YEN-YU;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 WANN CLEMENT HSINGJEN;YEH LING-YEN;SHIH CHI-YUAN;CHEN YEN-YU
分类号 H01L23/48;H01L21/20;H01L29/772 主分类号 H01L23/48
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