| 摘要 |
<p>This power conversion device is equipped with: a semiconductor power module (11) in which a heat dissipation member (13) is formed on one surface of a case body; a cooling body (3) that is joined to the heat dissipation member; mounting boards (22, 23) that include heat-generating circuit components; and heat-transmitting metal support plates (32, 33) for supporting the mounting boards at prescribed gaps from the semiconductor power module. The heat dissipation member is provided with a protruding liquid-contact section (17) that is formed on the side joined to the cooling body, and the cooling body is provided with an immersion section (5) for immersing the liquid-contact section in a coolant and a circumferential groove (6) that is formed on the outer side of the immersion section and has an O-ring fitted therein. The heat dissipation member and the cooling body sandwich the heat-transmitting metal support plates with the joining surfaces located on the outer side of the circumferential groove. The cross-sectional diameter of the O-ring is set to a value larger than the value of the thickness of the heat-transmitting metal support plates and the depth of the circumferential groove combined.</p> |
