SUBSTRATE CARRIER FOR MOLDING ELECTRONIC DEVICES

摘要

SUBSTRATE CARRIER FOR MOLDING ELECTRONIC DEVICES 5Amethod of molding a substrate containing a plurality of electronicdevices by providing a carrier comprising a frame which includes anadhesive film. The substrate is mounted onto the adhesive film of thecarrier such that the frame surrounds the substrate. The carrier isplaced in a mold such that the frame is located at a clamping area ofthe mold and the substrate is located at a molding 10 area of themold where molding cavities are located. The frame is clamped at theclamping area while the electronic devices are located in the moldingcavities for molding with an encapsulant. (FIG. 8) 15