发明名称 POLISHING SYSTEM AND ABRASIVE LIFE DETERMINATION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a polishing system for properly determining the life of a metal oxide abrasive in comparison with a conventional system in order to effectively utilize the metal oxide abrasive, and to provide an abrasive life determination method.SOLUTION: A peak of a radial distribution of Ce atom on the surface of a ceria abrasive and oxygen adjacent thereto is found by analyzing X-ray absorption properties measured by an electron yield method XAFS measurement section 48, and the life of the ceria abrasive can be determined on the basis of a height h of the peak. Accordingly, the life of the ceria abrasive can more properly be determined, in comparison with a conventional polishing system in which the life of the abrasive is determined from experience using polishing data in the repeated use and a grinding test is performed in each case for confirmation. For example, it can be properly prevented that the ceria abrasive with remaining polishing ability is discarded in a multi-product manufacturing line, or that failures are caused on the polished surface of a substrate 14 to be polished by using the ceria abrasive after the life is over.
申请公布号 JP2014028424(A) 申请公布日期 2014.02.13
申请号 JP20120170610 申请日期 2012.07.31
申请人 NORITAKE CO LTD;KYUSHU UNIV 发明人 TAKAHASHI YOSUKE;SATO MAKOTO;OMORI HISASHI;NISHIBORI MAIKO
分类号 B24B37/00;G01N23/06;H01L21/304 主分类号 B24B37/00
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