| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem of a short circuit occurring between bump electrodes because a solder of the bump electrode bridges the neighboring bump electrodes during heating for reflow when flux bridges the neighboring bump electrodes.SOLUTION: A semiconductor device comprises: a solder layer (Sn/Ag plating layer 29) formed on an end face of each back bump 22 on a semiconductor chip 15b in which each back bump 22 of the semiconductor chip 15b is bonded to each surface bump 16 of a semiconductor chip 15a by transferring of flux 33 on the solder layer and melting of the solder layer; and salients 24 (stepped parts) each provided on a rear face of the semiconductor chip 15b between two neighboring back bumps 22 among multiple back bumps 22 for blocking the flux 33. |
