| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an electronic device capable of dissipating heat surely from a plurality of heating elements having shape or size different from each other, without increasing the thermal resistance.SOLUTION: The heat dissipation structure of an electronic device is configured to cool a plurality of electronic components 3r and 3l of different height mounted on a substrate 5 by transmitting heat therefrom to a thermal diffusion plate 6 attached to the substrate 5. A flexible interposer 4 having an elastically stretching sheet-like base material 4a, and a plurality of telescopic pins 4b convex for the base material 4a is provided between the substrate 5 and the electronic components 3r and 3l. At least one of the electronic components 3r and 3l is pressed against the thermal diffusion plate 6 by the elastic force of the flexible interposer 4, and the substrate 5 and the electronic components 3r and 3l are connected electrically by means of the plurality of pins 4b. |
