发明名称 PACKAGING MATERIAL TO BE THERMALLY WELDED TO PACKAGE
摘要 <p>A packaging material to be thermally welded to a package, which is characterized by comprising a gas barrier film (12), an intermediate layer (16) that is bonded to the gas barrier film by means of a first adhesive layer (14), and a thermal welding layer (20) that is bonded to the intermediate layer by means of a second adhesive layer (18). This packaging material is also characterized in that: the gas barrier film has a laminated structure wherein one or more combinations of one inorganic layer (28) that has gas barrier properties and one organic layer (26) that serves as a base layer for the inorganic layer are formed on a supporting body (24) so that an organic layer (26) forms the outermost layer; the glass transition temperature of the organic layer is higher than the glass transition temperatures of the intermediate layer and the supporting body of the gas barrier film; and the glass transition temperatures of the intermediate layer and the supporting body of the gas barrier film are higher than the glass transition temperature of the thermal welding layer.</p>
申请公布号 WO2014024602(A1) 申请公布日期 2014.02.13
申请号 WO2013JP68026 申请日期 2013.07.01
申请人 FUJIFILM CORPORATION 发明人 IWASE EIJIRO
分类号 B65D65/40;A61J1/10;B32B27/00 主分类号 B65D65/40
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