DRY ETCHING DEVICE AND DRY ETCHING METHOD

摘要

The purpose of the present invention is to provide a dry etching device whereby the surface of a substrate can be etched on the vertical, with good accuracy. The means for solving the problem is to provide the device with: an electrostatic chuck (13) by which a substrate (W) to undergo a dry etching process is held through electrostatic attraction on a chucking surface (23), and having a coolant gas injection aperture (25) for injecting a coolant gas into a gap (26) at the back side of the substrate, situated between the back surface of the substrate (W) and the chucking surface (23); and a mass flow controller (33) for controlling the pressure of the coolant gas within the gap (26) at the back side of the substrate, bringing the substrate (W) into a flat shape or an arcuate shape of downwardly depressed cross section. The chucking surface (23) is formed to downwardly depressed shape, accommodating the downwardly depressed cross sectional shape of the substrate (W) when held thereon through electrostatic attraction.